
This document was generated on 01/17/2014
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Part Number:
Status:
Overview:
Description:
Active
1.00mm Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins,
Green Housing and Off-White Latches, 0.38μm Gold (Au) Plating, 2.67mm Soldertail,
240 Circuits, Lead-Free
Documents:
Series
image - Reference only
Agency Certification
CSA
UL
LR19980
E29179
ELV and RoHS
Compliant
General
Product Family
Series
Component Type
Electrical Model
JEDEC Outline
Overview
Product Name
UPC
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
Durability (mating cycles max)
Entry Angle
Flammability
Keying to Mating Part
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
Net Weight
PC Tail Length
PCB Locator
PCB Retention
PCB Thickness - Recommended
Packaging Type
Pitch - Mating Interface
Pitch - Termination Interface
Plating min - Mating
Plating min - Termination
Temperature Range - Operating
Termination Interface: Style
Electrical
Current - Maximum per Contact
Voltage - Maximum
Voltage Key
Solder Process Data
Duration at Max. Process Temperature (seconds)
Memory Module Sockets
Socket
Yes
MO-269
DDR3 DIMM
884982233799
240
240
Green, Natural
25
Vertical
94V-0
Yes
Copper Alloy
Gold
Tin
High Temperature Thermoplastic
9.264/g
2.67mm
Yes
Yes
1.57mm
Tray
1.00mm
1.00mm
0.381μm
2.540μm
-55°C to +85°C
Through Hole
1A
30V AC (RMS)/DC
Center
10
Not Reviewed
Not Low-Halogen
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environmental compliance?
For a multiple part number RoHS Certificate of
Please visit the Contact Us section for any
non-product compliance questions.
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78079Series
Mates With
JEDEC Standard 1.27mm Modules